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CORE TECHNOLOGY

          LASER








          MULTIFUNCTION LASER
          MICROMACHINING
          FOR COATING

          REMOVAL, CLEANING,
          AND PRECISION
          CORRECTION
          PROCESSES.

















 TAIFUN-CLEAN® SURFACE CLEANING MODULE  MICROMETRIC PRECISION




                                                               LASER TECHNOLOGY

          The SNAP LIGHT module expands                           » Laser spot: ≥ 30 μm.
          the MSTECH software suite with a
          high-precision laser micromachining                     » Working area: 500 x 500 mm (optional
                                                                 up to 610 × 610 mm).
          system designed for critical correction                 » Air-cooled system.
          and adjustment tasks in electronic                      » Cooling: Air (SE).
          manufacturing. It performs ultra-                       » Marking area indicator.
          accurate ablation, marking, cleaning,                   » Internal barcode generator.
          and edge-finishing operations with                      » Marca full graphics PC Software.

          full digital control.                                   » Included in SMART INFINITY platform
                                                                 compatible with SNAP VISION, SNAP
          Working in synergy with SNAP                           MOTION, and SMARTBOX (optional).
          VISION, it enables a fully automated
          and reliable workflow — while the                    APPLICATIONS
          vision system identifies the target
          zones, SNAP LIGHT executes with                         » Surface activation & cleaning (oxides,
                                                                  residues, thin contaminants).
          micrometric precision, ensuring                         » Sintering & curing of functional inks,
          maximum efficiency, repeatability,                      coatings, and polymers.
          and reduced process errors.                             » Laser marking & localized ablation.
                                                                  » Via etching & micro-machining of dielectric
                                                                  substrates.
                                                                  » Material removal & thickness trimming.
                                                                  » Precision cutting, slotting & depaneling.



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